Page 8 - SCHERDELnews 2/15e

PRODUCTION

New technologies ensure s

Electromobility products demand the growth of ma

PRODUCTION PROCESSES – MECHANICAL ENGINEERING – TECHNOLOGY & PRODUCT DEVELOPMENT – NEWS AND INFORMATION C ustomer requirements are exten- have such in-depth knowledge of the
sive and varied, particularly in the bonding process to ensure what you
field of electromobility. When manufac- produce is high quality without testing
turing these products, the focus is as it. In terms of quality, it is just as impor-
much on new technologies as it is on tant to have the ability to create an ad-
high cleanliness standards during man- hesion friendly, reliable and repro-
ufacture – criteria that were identified ducible surface for the part being bond-
and met for a number of restructuring ed.
measures by the SCHERDEL plant in
Bor. Completely in keeping with the Hot crimping is yet another technolo-
maxim of the SCHERDEL corporate gy applied in Bor. The process is well-
philosophy “progress based on tradi- known from medical engineering, hy-
tion”, the Czech company has designed brid and electric vehicle production or
for the active spread of innovation from from its utilisation in generator and en-
the start – not just in terms of products, gine construction. It is a joining technol-
but also for manufacturing methods – ogy for connecting enamelled copper
and thus performs pioneering work for wires securely and positively without
the entire Group. first having to strip the insulation. Hot

Specialists at the plant in Bor have
developed a bonding installation
with dosing function for bonding
capacitors which helps to prevent
heat-related problems when con-
necting components.

Whilst introducing new technologies crimping can even be used economi-

and enhancing capabilities, the experts cally to manufacture a wide array of

at SCHERDEL in Bor developed a variants for ultra-small batch produc-

bonding installation with dosing func- tion. The key is to release mechanical

tion for bonding capacitors. The system pressure and electrical current in the

helps to prevent negative heat capaci- shortest weld time possible. Hot crimp-

ties caused by distortion, cooling stress ing vaporises the insulation of each in-

or structural changes when connecting dividual enamelled copper wire without

The editorial team of components. In contrast to the use of having any impact on the copper itself.

SCHERDELnews looks for- bolts or rivets, there are no holes re- The vaporised varnish escapes and is

ward to your contribution. quired that naturally weaken a compo- extracted mechanically. All connections

Please send topic sugges- nent. When bonding, force is trans- therefore display the best mechanical

tions, wishes or feedback ferred across the face from one bonded and electrical properties. Consequently,

to: part to the other. However, bonding is problems caused by the deteriorating

scherdelaktuell@scherdel.de technically very challenging and de- contact of individual wires, slip effects
mands a great deal of skill. The me- or subsequent component failure due
or contact chanical strength of the bond in the in- to oxidation, vibration, temperature and
Wolfgang Schelter on: terface layer between the glue and the environmental influences are a thing of
+49 9231 603-115 surface of the part and its durability the past.

cannot be measured in a non-destruc-
8 tive manner. It is therefore essential to